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Memory maker Micron Technology says that it has cooked up the first DDR3 main memory modules for servers to make use of a new technology, called load-reduced dual-inline memory module (LRDIMM) packaging. The new packaging will not only allow server makers to put fatter memory sticks into their boxes, but more of them than they otherwise would be able to.
Servers that employ Intel's current quad-core "Nehalem EP" Xeon 5500s for two-socket servers (launched in March) and future eight-core "Nehalem EX" Xeon 7500s for four-socket and larger servers (due at the end of the year for shipments in early 2010 inside servers) use DDR3 registered DIMM (RDIMM) memory. It is expected that Advanced Micro Devices' future twelve-core "Magny-Cours" and six-core "Lisbon" Opterons, IBM's eight-core Power7 chips, and Fujitsu's eight-core "Venus" Sparc64-VIII chips will also support DDR3 RDIMMs.
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